◆ 2006.10 公司於台灣成立，針對亞洲及美國市場開發。
◆ 公司成立針對3C產業和LED 照明上散熱的問題，提供適當的解決設計和方法，並對材料和零件的技術整合和掌控。
◆ 核心技術:
– Innovation & Creativity of Cost-Effective Cooling Solutions & Materials
– Economical Sources of Extrusion, Die-Casting, Sheet Metal, Heat Pipe and Thermal Interface Materials.
– Expertise of CAD, Thermal, Mechanical 3D, Optical Simulations
– In-House Mock-up & Prototypes Verifications and Debugging
◆公司營運重點:
Specialization in Heat Spreading Material & Modules, Slim Platform Cooling, and Passive Cooling, Cost-Performance Optimization
【Thermal Interface Materials】- Silicone 、Adhesive 、Grease 、Graphite (Heat Spread) 、Epoxy 、
Thermal Tape
【LED lighting、thermal design】-LED lighting thermal 、Dielectric Film 、MCPCB 、Flexible MCPCB 、Structural MCPCB
【Modules Design & Verification Services】-Thermal Verification 、Cooling Design 、Mechanical Design 、Thermal, Electrical 、Mechanical & Structural 、Design Integration 、ODM Sourcing & Logistics 
